[Megaco] RE: H.248.V5 vs H.248.STIMAL; Re: [LS to SG16 RGW stimal package ] Approved

Jan Lindquist (AL/EAB) jan.lindquist at ericsson.com
Thu Aug 19 04:49:08 EDT 2004


Hello Albrecht,

Actually the first liaison you refer to is indicating to SG16 the intention of TISPAN WG3 to create a new package, at the time there was no agreed package or package name.  The new liaison indicates that there is now a package defined called stimal package and that there is an ambition to perform a joint publication between TISPAN and ITU-T, for more details refer to the new liaison.

I hope this answers your question.

Best regards,
JanL

> -----Original Message-----
> From: Albrecht.Schwarz at alcatel.de [mailto:Albrecht.Schwarz at alcatel.de]
> Sent: den 18 augusti 2004 18:01
> To: raymond.forbes at MARCONI.COM; Jan Lindquist (AL/EAB);
> d.chohan at ftel.co.uk
> Cc: TISPAN_WG3 at LIST.ETSI.ORG; megaco at ietf.org;
> itu-sg16 at external.cisco.com
> Subject: H.248.V5 vs H.248.STIMAL; Re: [LS to SG16 RGW stimal package]
> Approved
> 
> 
> Dear All!
> 
> A proposal for a H.248 V5 Package was presented at the last 
> WP2/16 meeting:
> http://ftp3.itu.int/av-arch/avc-site/0405_Bei/AVD-2502a.zip
> 
> Question: is H.248.STIMAL replacing the H.248.V5 package proposal?
> 
> Thanks for clarification!
> Best regards
> Albrecht
> 
> 
> Raymond Forbes <raymond.forbes at MARCONI.COM>@LIST.ETSI.ORG> on 
> 18/08/2004
> 17:33:46
> 
> Please respond to Raymond Forbes <raymond.forbes at MARCONI.COM>
> 
> Sent by:    "TISPAN_WG3: Protocols" <TISPAN_WG3 at LIST.ETSI.ORG>
> 
> 
> To:    TISPAN_WG3 at LIST.ETSI.ORG
> cc:
> Subject:    Fw: [LS to SG16 RGW stimal package] Approved
> 
> 
> 
> WG3 delegates,
> 
> The Liaison Statement to ITU SG16 is now approved, see attachment.
> 
> Regards,
> 
> Ray Forbes. (TISPAN WG3 Chairman)
> 
> +44 24 7656 3106 phone
> +44 24 7656 3816 fax.
> +44 771 851 1361 Mobile/text
> ------------
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> 
> (See attached file: 03bTDxxx LS_to_SG16_on_stimal_pkg_v2 approved.doc)
> 
> 
> 

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